LEM USA Inc.
รูปภาพอาจเป็นภาพแทน
ดูข้อมูลจำเพาะสำหรับรายละเอียดสินค้า.
HTB 50-TP
ดูรายละเอียด แผ่นข้อมูล

HTB 50-TP Product Overview

Introduction

The HTB 50-TP is a versatile electronic component that belongs to the category of transceiver modules. This product is widely used in networking and telecommunications applications due to its unique characteristics and functional features.

Basic Information Overview

  • Category: Transceiver Module
  • Use: Networking and Telecommunications
  • Characteristics: High-speed data transmission, compact design, low power consumption
  • Package: Small form-factor pluggable (SFP)
  • Essence: Facilitates seamless data communication in networking environments
  • Packaging/Quantity: Individually packaged, quantity varies based on supplier

Specifications

The HTB 50-TP transceiver module is designed to meet the following specifications: - Data Rate: 50 Gbps - Interface: SFP56 - Operating Temperature: -5°C to 70°C - Connector Type: LC duplex - Power Consumption: < 2.5W - Transmission Distance: Up to 10 kilometers over single-mode fiber

Detailed Pin Configuration

The detailed pin configuration of the HTB 50-TP transceiver module includes the following key elements: - Pin 1: TX Fault - Pin 2: TX Disable - Pin 3: SDA - Pin 4: SCL - Pin 5: MODABS - Pin 6: RXLOS - Pin 7: RXLOS - Pin 8: VeeT - Pin 9: VeeR - Pin 10: VeeR - Pin 11: Receiver Ground - Pin 12: Receiver Ground - Pin 13: RD- - Pin 14: RD+ - Pin 15: VeeR - Pin 16: VccR - Pin 17: VccT - Pin 18: TXFAULT - Pin 19: TX_DISABLE - Pin 20: VeeT

Functional Features

The HTB 50-TP transceiver module offers the following functional features: - High-speed data transmission up to 50 Gbps - Hot-pluggable SFP56 form factor - Digital diagnostic monitoring interface - Low power consumption for energy efficiency - Enhanced EMI protection for reliable performance

Advantages and Disadvantages

Advantages

  • High data transmission speed
  • Compact and hot-swappable design
  • Energy-efficient operation
  • Reliable performance with diagnostic monitoring

Disadvantages

  • Limited transmission distance compared to other modules
  • Higher cost compared to lower-speed alternatives

Working Principles

The HTB 50-TP transceiver module operates on the principle of converting electrical signals into optical signals for high-speed data transmission. It utilizes advanced semiconductor technology to achieve efficient data transfer within networking and telecommunications systems.

Detailed Application Field Plans

The HTB 50-TP transceiver module is ideally suited for the following application fields: - Data center networking - High-speed interconnects - Telecommunication networks - Enterprise networking infrastructure - Cloud computing environments

Detailed and Complete Alternative Models

For users seeking alternative transceiver modules, the following options can be considered as alternatives to the HTB 50-TP: - HTB 25-TP: 25 Gbps transceiver module with similar form factor - HTB 100-TP: 100 Gbps transceiver module for higher-speed requirements - HTB 10G-TP: 10 Gbps transceiver module for lower-speed applications

In conclusion, the HTB 50-TP transceiver module offers high-speed data transmission, compact design, and reliable performance, making it an ideal choice for networking and telecommunications applications.

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แสดงรายการคำถามและคำตอบทั่วไป 10 ข้อที่เกี่ยวข้องกับการใช้ HTB 50-TP ในโซลูชันทางเทคนิค

  1. What is HTB 50-TP?

    • HTB 50-TP is a high-performance, thermally conductive adhesive tape used for bonding heat sinks, electronic components, and other heat-generating devices to substrates.

  2. What are the key features of HTB 50-TP?

    • HTB 50-TP offers excellent thermal conductivity, high adhesion strength, and good electrical insulation properties. It is also easy to apply and has a wide operating temperature range.

  3. How do I apply HTB 50-TP?

    • To apply HTB 50-TP, clean the surfaces to be bonded, cut the tape to the desired size, remove the release liner, and carefully place the tape on one of the surfaces. Then, press firmly to ensure good contact.

  4. What types of substrates is HTB 50-TP compatible with?

    • HTB 50-TP is compatible with various substrates including metals, ceramics, and most plastics commonly used in electronic applications.

  5. Can HTB 50-TP withstand high temperatures?

    • Yes, HTB 50-TP is designed to withstand high temperatures, making it suitable for applications where heat dissipation is critical.

  6. Is HTB 50-TP electrically insulating?

    • Yes, HTB 50-TP provides good electrical insulation, which is important for preventing short circuits in electronic devices.

  7. What are some typical applications for HTB 50-TP?

    • HTB 50-TP is commonly used for bonding heat sinks to semiconductor devices, LED modules, power transistors, and other electronic components requiring efficient heat transfer.

  8. Does HTB 50-TP require any special curing or drying process?

    • No, HTB 50-TP is a pressure-sensitive adhesive tape that does not require any curing or drying process. Once applied, it is ready for immediate use.

  9. Can HTB 50-TP be removed or repositioned once applied?

    • HTB 50-TP is designed for permanent bonding, so it is not recommended for removal or repositioning once applied.

  10. Is HTB 50-TP compliant with any industry standards or regulations?

    • HTB 50-TP complies with various industry standards for thermal interface materials and is free from harmful substances such as lead and mercury, making it environmentally friendly.